The characteristic that is distinctive in all PBGA package substrate is the solder balls which are present at the lower surface of the package in an orderly manner of an array of balls in a grid fashion. These solder balls are in contact with the substrate traces and have corresponding and matching landing pads on the surface of the PCB when the BGA component is to be soldered on the PCB during the manufacturing of the PCBA. This ball grid makes it possible to have a high-density interconnect since the balls can be brought closer to each other.

Contact Info:-

High Quality PCB Co., Limited

Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China

Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China

Plant 2 address: Zhuhai, Guangdong, China

Plant 3 address: Dongguan, Guangdong, China

TEL: +86-755-23724206

WahtsApp: +86-189 2381 2997

Skype: shawnwang2006

Email: sales@efpcb.com